Tin electrolytes for PCB manufacture

This high-dispersion methane sulphonate matt tin bath has been developed as a metal resist or solderable end surface for the PCB industry.

The sulphate-free system is characterised by a very fine crystalline, semi-matt and bright deposit. The high dispersion bath can be used at very low and very high current densities. EC SN-PLATE 200 deposits are highly dense and the electrolyte is insensitive to entrainment and resist bleeding (leaching).

The bright deposits are well solderable and highly dense from the point a layer thickness of 2 µm is reached. The deposits are also stable during long etching times (thick copper) using ammoniacal etching solutions.

EC SN-PLATE 200 is also stabilised against the formation of tin (4+).

System profile

  • Methane sulphonate matt tin bath
  • Precipitation-free
  • Superior dispersion (HDI) and high density even at low layer thicknesses
  • Metal resist for thick copper technique too
  • Antioxidant additive for stable SN2+ content
  • High anode solubility
  • No frame tinning
  • High stability against resist contamination (leaching) and entrainment
  • Solderable and bright deposition

Application profile

  • Excellent washing characteristics
  • All components can be analysed

Galvanic tin bath

EC SN-PLATE 200 is a sulphate-free methane sulphonate matt tin batch which was developed for tinning PCBs. It disperses excellently and ensures fast and uniform separation at high current density in an extremely efficient manner. The bath is robust against resistance bleeding and can be managed sufficiently accurately by determining the metal and acid. The deposition is bright, fine crystalline and high density. It is excellent for plating microvias. The bath is stabilised against the production of tin IV and thereby protects racks, containers and pumps. Compared to sulphate baths, the anode solubility is extremely high. The deposition is RoHS compliant.

Further additives

  • EC SN-PLATE 201ME – Metal concentrate
  • EC SN-PLATE 203 ANOX – Antioxidant additive
  • EC SN-PLATE 204 GR – Grain refiner

Further electrolytes for the electronics industry