Inner layer bonding agent for PCB manufacture
EC THORN-BOND HL is an inner layer bonding agent for creating multilayers. It is based on hydrogen peroxide and sulphuric acid.
After treatment, it leaves behind a rough copper surface with a brown organic coating. A controllable layer thickness of the organic coating enables maximum adhesion values even with filled materials and special materials.
EC THORN-BOND HL is particularly economical thanks to its notably high copper absorption (high loading).
The system can be used horizontally and vertically.
System profile
- Uniform brown structure
- Excellent bonding agent for high-Tg and HF materials
- Low etching rate
- Controllable layer thickness organic coating
- Nitric acid-free and peroxide-stabilised
- Stable etching rate over its entire service life
- Very low precipitation formation
- Excellent filterability
- Very high copper absorption (high loading)
- Very low organic cargo (AOX and CSB)
Application profile
- Can be applied horizontally and vertically
- All components can be analysed
System additives
- EC THORN-BOND 101A – Inner layer bonding agent A (Modifier)
- EC THORN-BOND 102B – Inner layer bonding agent B (Promoter)
- EC THORN-CLEAN AC – Acidic cleaner
