Solder mask and resist pre-cleaning for PCB manufacture
GLIBRITE GB-4300R40 is an additive for hydrogen peroxide and sulphuric acid-based micro-etching. It was developed for the production of IC substrates and the HF application. Before coating with solder resist, dry resist or liquid resist, this working solution is used to roughen copper surfaces. Glibrite produces an optimal bonding primer for the subsequent resist or solder mask coating at a very low etching rate.
System profile
- Low etching rate (< 1 µm)
- Suitable for solder mask and resist pre-cleaning
- Effective on plated copper as well as base copper
- HF-compatible thanks to its optimised topography (skin effect)
- Realisation of fine structures therefore developable (no lock-in)
- High copper absorption ( > 40 g/l)
- Peroxide-sulphuric acid system
- Formic acid and acetic acid-free
- No grain boundary etching
- 2 dosing components
- Additive to bind interfering chloride ions
Application profile
- All components can be analysed
GLIBRITE GB-4300R40 – Micro-etch additive
GLIBRITE GB-4300R40 is an additive for hydrogen peroxide and sulphuric acid-based micro-etching. It is used to roughen up copper surfaces before coating with solder mask or resist. With its very low etch rate, the micro-etch creates the optimal bonding surface for the subsequent resist or solder mask coatings.
